EDN

Ansys releases Ansys Icepak 12.0 software

Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...
EDN

Thermal-management software reduces engineering time, speeds product development

Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...
Nasdaq

Ansys Provides Competitive Edge to Future Workforce Through Novel Release of Free Electronics Desktop Product for Students

Ansys lessens barriers to entry, empowers students to enhance electronics-specific simulation skillset and spurs the next generation of innovation Free download expands students' online access to ...
Nasdaq

Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...
Semiconductor Engineering

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...